Publications

Journal Papers

Conference Papers

Invited Conference Talks and Papers

Patents

Book Chapters and others

 

Invited Conference Talks (with Papers) (研討會邀請演講與論文)

  1. M.-F. Chang, et al.,” Next-Generation Energy-Efficient Computing for IoT and AI Chips: How to Overcome the Memory Wall,” IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), Oct. 2018 (Plenary Speech)

2.     M.-F. Chang*, “Emerging Memory Based Circuits for Beyond von Neumann Applications: Nonvolatile-Logic and Computing-in-Memory”, SSDM, Sept. 2018 (invited speaker)

3.     C. Dou, …. and M.-F. Chang*, “Nonvolatile Circuits-Devices Interaction for Memory, Logic and Artificial Intelligence” Symp. VLSI Technology, pp. xx-xx, June 2018 (invited speaker)

  1. M.-F. Chang, “Challenges of emerging memory and memristor based circuits: Nonvolatile logics, IoT security, deep learning and neuromorphic computing,“ IEEE 12th International Conference on ASIC (ASICON) , pp. 140-143, Oct. 2017 (Invited Talk/Paper)
  2. M.-F. Chang, ”Challenges in Resistive Memory Enabled Circuits and Systems:  Memory, Nonvolatile Logics and AI Chips,” JST ImPACT, Sept. 2017 (Keynote Speech)
  3. M.-F. Chang, ,” Memristor-Based Circuit Designs: From Nonvolatile Logics to Neuromorphic Computing Systems,” ISCAST (Sun-Moon Lake), Aug. 2017 (Invited talk/Abstract)
  4. M.-F. Chang, ,” Memristor-Based Circuit Designs: From Nonvolatile Logics to Neuromorphic Computing Systems,” IEEE (NVMSA), Aug. 2017 (Invited talk)
  5. M.-F. Chang, et al.,” Memristor-Based Circuit Designs: From Nonvolatile Logics to Neuromorphic Computing Systems,” International Conference on Memristive Materials, Devices & Systems (MEMRISYS), April 2017 (Keynote Speech)
  6. W. H. Chen, .., M.-F. Chang, “Circuit Design for Beyond Von Neumann Applications Using Emerging Memory: From Nonvolatile Logics to Neuromorphic Computing,” in Proc. International Symposium on Quality Electronic Design (ISQED), pp.xx-xx, March 2017. (Invited Paper/special session)
  7. M.-F. Chang,   “Challenges and Trends of Memory Circuit Designs for IoTs”, in Proc. IEEE International Conference on Integrated Circuits and Microsystems (ICICM 2016), pp. xxx – xxx, Nov. 2016. (Keynote Speech)
  8. M.-F. Chang*, et al., “A Sub-0.5V Charge Pump Circuit for Resistive RAM (ReRAM) Enabled Low Supply Voltage Nonvolatile Logics and Nonvolatile Processors,” in Proc. IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), pp. xxx – xxx, Aug. 2016. (Invited Talk/Paper)
  9. M.-F. Chang*, et al., “Designs of Emerging Memory Based Non-Volatile TCAM for Internet-of-Things (IoT) and Big-Data Processing: A 5T2R Universal Cell,” in Proc. IEEE International Symposium on Circuits and Systems (ISCAS), pp. 1142-1145, June 2016. (Invited Talk/Paper)
  10. M.-F. Chang*, et al., “Supply-Variation-Resilient Nonvolatile 3D IC and 3D Memory Using Low Peak-Current On-Chip Charge-Pump Circuits,” in Proc. IEEE Conference on Electron Devices and Solid-State Circuits (EDSSC), pp. 118 – 121, June 2015. (Invited Talk/Paper) (Singapore)
  11. M.-F. Chang, “Challenges in Circuits and Applications for Resistive RAM (ReRAM),” 2015 Frontier of Information Storage and Design Automation Technologies Workshop, May 2015 (Xian, China)
  12. M.-F. Chang, “Challenges in Circuits and Applications for Emerging Memory,” 2015 Tsinghua-ROHM International Forum of Industry-Academia, May 2015 (Beijing, China)
  13. M.-F. Chang*, et al., “Challenges at Sensing Circuits for Resistive Memory and Memristor-based Nonvolatile Logics,” in Proc. 2014 IEEE Asia South Pacific Design Automation Conference (ASP-DAC), pp. 569 – 574, Jan. 2015. (Invited Talk/Paper) (Tokyo, Japan)
  14. M.-F. Chang*, Albert Lee, C.-C. Kuo, S.-Shyuan Sheu, Fredrick. T Chen, Tzu-Kun Ku, Yong-Pan Liu, Hua-Zhong Yang, Ping-Cheng Chen, “Challenges at Circuit Designs for Resistive-Type Nonvolatile Memory and Nonvolatile Logics in Mobile and Cloud Applications“, in Proc. IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), pp. 1-4, Oct. 2014. (Invited Talk/Paper)
  15. M.-F. Chang, “Challenges in circuits and applications for resistive RAM (ReRAM),” 4th imec-Stanford International Workshop on Resistive Memories, Oct. 27-28, 2014 (Invited Talk) (Stanford University, USA)
  16. M.-F. Chang, “Challenges in Circuits and Applications for Resistive RAM (ReRAM),” IEEE Nonvolatile Memory Systems and Applications Symposium, Aug. 2014. (Invited Talk)
  17. M.-F. Chang, “Challenges in Circuits and Applications for Resistive RAM (ReRAM),” 2014 International Workshop on 3D IC, Aug. 19, 2014. (Invited Talk) (Shanghai Jiao Tong University, China)
  18. M.-F. Chang, “Challenges at Circuits Designs for Nonvolatile Memory and Logics in Dependable Systems,” 2nd JST International Symposium on Dependable VLSI Systems (DVLSI 2013), Dec. 2013. (Keynote Speech) (Tokyo, Japan).
  19. M.-F. Chang, “Challenges in Circuit Designs for Resistive RAM (ReRAM) and ReRAM-based Nonvolatile Logics,” 2013 Cloud, Storage and Big Data Shanghai Summit & Asia Nonvolatile Memory Workshop, July 2013. (Invited Talk) (Shanghai, China)
  20. M.-F. Chang, “Challenges in Design and Test for 3D Memory “, in Special session 4C: Hot topic 3D-IC design and test, IEEE VLSI Test Symposium, pp. 1, April 2013. (Invited Talk) (Berkeley, USA)
  21. M.-F. Chang, “Circuit Design Challenges of Next-Generation Energy-Efficient Memory”, IEEE Electron Devices Society (EDS) Mini-Colloquium on Advanced Technology of Micro & Nanoelectronics, Oct. 2012. (Invited Talk) (PKU, Beijing, China)
  22. M.-F. Chang*, et al. “Circuit Design Challenges and Trends in Read Sensing Schemes for Resistive-Type Emerging Nonvolatile Memory“, in Proc. IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), pp. 1-4, Oct. 2012. (Invited Talk/Paper)
  23. M.-F. Chang*, C.-H. Chuang, M.-P. Chen, L.-F. Chen, H. Yamauchi, P.-F. Chiu, and S.-S. Sheu, “Endurance-Aware Circuit Designs of Nonvolatile Logic and Nonvolatile SRAM Using Resistive Memory (Memristor) Device,” in Proc. 2012 IEEE Asia South Pacific Design Automation Conference (ASP-DAC), pp. 329 – 334, Jan. 2012. (Invited Talk/Paper) (Sydney, Australia)
  24. M.-F. Chang*, et al., “Challenges and Trends in Low-Power 3D Die-Stacked IC Designs Using RAM, Memristor Logic, and Resistive Memory (ReRAM),” The IEEE 9th International Conference on ASIC (ASICON), pp.327-330, Oct. 2011. (Invited Talk/Paper) (Xiamen, China)
  25. M.-F. Chang*, et al., “Challenges and Trends of Resistive Memory (Memristor) Based Circuits for 3D-IC Applications,” 2011 Symposium on Solid State Devices and Materials (SSDM), pp. 1053-1054, Sep. 2011. (Invited Talk/Paper) (Nagoya, Japan)
  26. M.-F. Chang*, P. F. Chiu and S.-S. Sheu, “Circuit design challenges in embedded memory and resistive RAM (RRAM) for mobile SoC and 3D-IC,” in Proc. 2011 IEEE Asia South Pacific Design Automation Conference (ASP-DAC), pp.197-203, Jan. 2011. (Invited Talk/Paper)
  27. M.-F. Chang* and P.-C. Chen, “Embedded non-volatile memory circuit design technologies for mobile low-voltage SoC and 3D-IC," in Proc. IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), pp. 13-16, Nov. 2010. (Invited Talk/Paper)

 

Recent Invited Tutorials, Forums, and Panelists at International Conferences (no papers)

  1. M.-F. Chang, “Nonvolatile Circuits for AI Edge Application“, in Short Course “Opportunities and Challenges at the Intersection of Security and AI,” Symp. VLSI Technology, June 2019. (invited short course talk)
  2. M.-F. Chang, “Panel: Technologies for AI Chips: Challenges and Opportunities,” IEEE China Semiconductor Technology International Conference (CSTIC), March, 2019 (invited panelist)
  3. M.-F. Chang, “Challenges in Circuit Designs and Devices-Circuits Interaction for Computing-in-Memory,” IEEE China Semiconductor Technology International Conference (CSTIC), March, 2019 (invited talk)
  4.  M.-F. Chang, “The Circuits and Systems for Mobile AI” Panel Discussion, IEEE Asia Solid-State Circuit Conference (A-SSCC), Nov. 2018 (Panel Moderator)
  5. M.-F. Chang, et al.,” Memristor Enabled Energy-Efficient Chips for IoT and AI: Nonvolatile Logics and Computing-in-Memristors,” International Conference on Memristive Materials, Devices & Systems (MEMRISYS), July 2018 (Plenary Speech)
  6. M.-F. Chang, Panel “Will the Era of AI Provide an Opportunity for Emerging Technologies to Overtake CMOS?” Design Automation Conference (DAC), (Invited talk/panelist) June 2018.
  7. M.-F. Chang, Circuit Panel “What is the next big thing after smart phone?” Symposium on VLSI Circuits, (Invited talk/panelist) June 2018.
  8. M.-F. Chang, “Tutorial: Nonvolatile Circuits for Memory, Logics and AI,” IEEE International Solid-State Circuits Conferences (ISSCC), Feb. x, 2018. (Tutorial Speaker)
  9. M.-F. Chang, Panel“”, Future Chip, Beijing, China, (Invited talk/panelist)
  10. M.-F. Chang, “Future of Memory System and Technology (PIM)” Panel Discussion, IEEE Asia Solid-State Circuit Conference (A-SSCC), Nov. 2017 (Invited Panelist)
  11. M.-F. Chang, “Fourm-3: Beyond the Horizon of Conventional Computing: From Deep Learning to Neuromorphic Systems, Introduction” IEEE International Solid-State Circuits Conferences (ISSCC), Feb. 9, 2017. (Speaker and Organizer)

12.  M.-F. Chang, “Embedded Memory Designs for Energy-Efficient IoT Devices,” IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Oct. 25, 2016. (Invited Tutorial Speaker) (Hangzhou, China)

13.  M.-F. Chang, “Circuit Designs and Architecture-Circuit interactions for Emerging Memory,” Existing and Emerging Memory Technologies and Circuits for Architects, IEEE/ACM International Symposium on Microarchitecture (MICRO), Oct. 16, 2016. (Invited Tutorial Speaker) (Taipei, Taiwan)

  1. M.-F. Chang, “Circuit and Device Interactions for Nonvolatile Memory in IoT Era,”IEEE International Conference on Integrated Circuit Design and Technology (ICICDT), June 27, 2016. (Invited Tutorial Speaker) (Ho Chi Minh City, Vietnam)
  2. M.-F. Chang, et al., “Circuit Panel Session: Top Circuit Techniques: Life With and Without Them,” Symposium on VLSI Circuits (VLSI), June 16, 2016. (Invited Panelist) (Hawaii, US)
  3. M.-F. Chang, “On-chip Nonvolatile Memory Designs for Energy-Efficient IoT,” IEEE International Symposium on Quality Electronic Design (ISQED), March 15, 2016. (Invited Tutorial Speaker) (Santa Clara, US)
  4. Y. Xie and M.F. Chang, “3D : From Technology to Applications - 3D Applications”, IEEE European Solid-State Circuits Conference (ESSCIRC), 2014 (Venice, Italy) (Invited Tutorial Speaker)
  5. M.-F. Chang, et al., “Panel Discussion 2: 0.5V and Beyond SoC Platform; How and Who Can Make It Up” IEEE Asia Solid-State Circuit Conference (A-SSCC), Nov. 2011. (Invited Panelist). (Jeju, Korea)