{"id":98,"date":"2021-01-13T11:41:42","date_gmt":"2021-01-13T11:41:42","guid":{"rendered":"https:\/\/www.ee.nthu.edu.tw\/tschu\/?page_id=98"},"modified":"2021-01-16T06:58:27","modified_gmt":"2021-01-16T06:58:27","slug":"activities","status":"publish","type":"page","link":"https:\/\/www.ee.nthu.edu.tw\/tschu\/?page_id=98","title":{"rendered":"Professional Activities"},"content":{"rendered":"\n<h3>Technique Review Committee<\/h3>\n\n\n\n<figure class=\"wp-block-table is-style-regular\">\n<table style=\"width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 24.2391%;\">2010 &#8211; 2021<\/td>\n<td style=\"width: 75.6522%;\">National Chip Implementation Center (CIC) Chip Design Review Committee<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2020<\/td>\n<td style=\"width: 75.6522%;\">&#8220;Core Group Project&#8221; of National Taiwan University Project Review Committee<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2019 &#8211; 2020<\/td>\n<td style=\"width: 75.6522%;\">&#8221; National Defense Science and Technology &#8221; Project Review Committee<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2020<\/td>\n<td style=\"width: 75.6522%;\">Microelectronics Project Review Committee<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2019<\/td>\n<td style=\"width: 75.6522%;\">Formosat-8 Satellite X-band Communication System Technical Auditor<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2019<\/td>\n<td style=\"width: 75.6522%;\">Hsinchu Science Industrial Park Company Stationed Review Committee<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2017<\/td>\n<td style=\"width: 75.6522%;\">Microelectronics Project Review Committee<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.2391%;\">2012<\/td>\n<td style=\"width: 75.6522%;\">Industrial Technology Research Institute of Taiwan (ITRI) FY102 Explore Project Review Committee<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<h3><strong>IEEE Activities<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\">\n<table style=\"width: 100%; height: 52px;\">\n<tbody>\n<tr style=\"height: 52px;\">\n<td style=\"width: 24.5652%; height: 52px;\">2019 &#8211; 2020<\/td>\n<td style=\"width: 75.3261%; height: 52px;\">IEEE National Tsing Hua University Student Branch Counselor<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<h3><strong>IEEE Conference Services<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\">\n<table style=\"width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 24.4565%;\">2014<\/td>\n<td style=\"width: 75.4348%;\">IEEE International Solid-State Circuits Conference (ISSCC) Forum Invited Speaker<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.4565%;\">2012 &#8211; 2014<\/td>\n<td style=\"width: 75.4348%;\">IEEE International Symposium on Circuits and Systems (ISCAS) TPC Member<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.4565%;\">2012 &#8211; 2013<\/td>\n<td style=\"width: 75.4348%;\">Progress in Electromagnetics Research Symposium (PIERS) TPC Member<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.4565%;\">2012<\/td>\n<td style=\"width: 75.4348%;\">International Symposium on VLSI Design, Automation and Test Session Chair<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 24.4565%;\">2012<\/td>\n<td style=\"width: 75.4348%;\">VLSI\u00a0Design\/CAD\u00a0Symposium TPC Member<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<h3><strong>IEEE Journal Associate Editor<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\">\n<table style=\"width: 100%;\">\n<tbody>\n<tr>\n<td style=\"width: 24.7826%;\">2018 &#8211; 2019<\/td>\n<td style=\"width: 75.1087%;\">IEEE Transactions on Microwave Theory and Techniques (T-MTT) Associate Editor<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/figure>\n\n\n\n<h3><strong>IEEE Official Journal Referee<\/strong><\/h3>\n\n\n\n<figure class=\"wp-block-table\"><table><tbody><tr><td>IEEE Journal of Solid-State Circuits (JSSC)<\/td><\/tr><tr><td>IEEE Transactions on Circuits and Systems I (TCAS-I)<\/td><\/tr><tr><td>IEEE Transactions on Circuits and Systems II (TCAS-II)<\/td><\/tr><tr><td>IEEE Transactions on VLSI Systems (TVLSI)<\/td><\/tr><tr><td>IEEE Transactions on Microwave Theory and Techniques (T-MTT)<\/td><\/tr><tr><td>IEEE Microwave and Wireless Components Letters (MWCL)<\/td><\/tr><tr><td>IEEE Wireless Communications Letters (ICW)<\/td><\/tr><tr><td>IEEE Transactions on Signal Processing (ITSO)<\/td><\/tr><\/tbody><\/table><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>Technique Review Committee 2010 &#8211; 2021 National Chip Implementation Center (CIC) Chip Design Review Committee 2020 &#8220;Core Group Project&#8221; of<\/p>\n<p><a href=\"https:\/\/www.ee.nthu.edu.tw\/tschu\/?page_id=98\" class=\"more-link\">Continue reading<span class=\"screen-reader-text\">Professional Activities<\/span><\/a><\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"_links":{"self":[{"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=\/wp\/v2\/pages\/98"}],"collection":[{"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=98"}],"version-history":[{"count":8,"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=\/wp\/v2\/pages\/98\/revisions"}],"predecessor-version":[{"id":133,"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=\/wp\/v2\/pages\/98\/revisions\/133"}],"wp:attachment":[{"href":"https:\/\/www.ee.nthu.edu.tw\/tschu\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=98"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}