09910ENE 634000半導體功率元件(Semiconductor Power Devices)
| 課程內容： |
| 一,課程說明(Course Description) This course aims to provide students with a comprehensive view of modern semiconductor devices for power electronic applications. After completing this course, the students will be able to understand the operating physics and electrical characteristics of power devices, as well as their design considerations. 二,指定用書(Text Books) 1. B.J. Baliga, Power Semiconductor Devices, PWS Publishing Co., latest edition. 2. Class notes 三,參考書籍(References) 1. Mohan, Undeland, and Robbins, Power Electronics: Converters, Applications and Design, John Wiley and Sons, latest edition. 四,教學方式(Teaching Method) In Chinese. 五,教學進度(Syllabus) 1. Semiconductor fundamentals and transport physics (2 weeks) 2. Breakdown mechanisms and edge terminations (2 weeks) 3. Power rectifier (2 weeks) 4. Power BJT and thyristor (2 weeks) 5. Power MOSFET (2 weeks) 6. Insulated gate bipolar transistor (IGBT) (2 weeks) 7. Other high-power devices (2 week) 9. Power ICs (2 week) 六,成績考核(Evaluation) Project 30%, Midterm 35%, Final 35%. 七,講義位址(http://) moodle.nthu.edu.tw |
09820ENE 531000微電子工程(Microelectronic Engineering)
| 課程內容： |
| 一、課程說明(Course Description) This course will survey the technologies that have been used to manufacture electronic, mechanical, and optical devices with scales down to nanometers. The students will have a comprehensive view of the science and engineering of microelectronic fabrication 二、指定用書(Text Books) J. D. Plummer, M. M. Deal, and P. B. Griffin, Silicon VLSI Technology, Prentice Hall, 2000. 三、參考書籍(References) 1. S. A. Campball, The Science and Engineering of Microelectronic Fabrication, Oxford University Press, 2001. 2. M. Madou, Fundamentals of Microfabrication, CRC Press, 1997. 四、教學方式(Teaching Method) In Chinese 五、教學進度(Syllabus) 1. Introduction 2. Modern Electronic Device Technology 3. Crystal Growth, Wafer Fabrication and Basic Properties of Silicon Wafers 4. Semiconductor Manufacturing 5. Lithography 6. Thermal Oxidation 7. Diffusion 8. Ion Implantation 9. Thin Film Deposition 10. Etching 11. Back-end technology 六、成績考核(Evaluation) Midterm1 30%, Midterm2 35%, Final 35% 七、可連結之網頁位址 moodle.nthu.edu.tw |